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Author: Admin | 2025-04-28
Chip. In Proceedings of IEEE/ECTC, 720–723. Google Scholar Okayama, Y., M. Nakasato, K. Saitou, Y. Yanase, H. Kobayashi, T. Yamamoto, R. Usui, and Y. Inoue. 2010. Fine pitch connection and thermal stress analysis of a novel wafer level packaging technology using laminating process. In Proceedings of IEEE/ECTC, 287–292. Google Scholar Honda, K., T. Enomoto, A. Nagai, and N. Takano. 2010. NCF for wafer lamination process in higher density electronic packages. In Proceedings of IEEE/ECTC, 1853–1860. Google Scholar Honda, K., A. Nagai, M. Satou, S. Hagiwara, S. Tuchida, and H. Abe. 2012. NCF for pre-applied process in higher density electronic package including 3D-package. In Proceedings of IEEE/ECTC, 385–392. Google Scholar Fukushima1, T., Y. Ohara, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi. 2012. Non-conductive film and compression molding technology for self-assembly-based 3D integration. In Proceedings of IEEE/ECTC, 393–398. Google Scholar Ito1, Y., M. Murugesan, H. Kino, T. Fukushima, K. Lee, K. Choki, T. Tanaka, and M. Koyanagi. 2015. Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges. In Proceedings of IEEE/ECTC, 336–341. Google Scholar Choubey, A., E. Anzures, D. Fleming, A. Dhoble, L. Herong, R. Barr, J. Calvert, and J. Oh. 2014. Non-conductive film (NCF) underfill for flip chip assembly and high reliability. In Proceedings of International Wafer Level Packaging Conference, 1–7. Google Scholar Lee, D., K. Kim, K. Kim, H. Kim, J. Kim, Y. Park, J. Kim, D. Kim, H. Park, J. Shin, J. Cho, K. Kwon, M. Kim, J. Lee, K. Park, B. Chung, and S. Hong. 2014. A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV. In Proceedings of IEEE/ISSCC, 433–435. Google Scholar Shin, J., Y. Kim, H. Lee, U. Kang, S. Seo, and K. Paik. 2015. Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF). In Proceedings of IEEE/ECTC, 910–915. Google Scholar Lee, H., Y. Choi, J. Shin, and K. Paik. 2015. Wafer level packages (WLPs) using B-stage non-conductive films (NCFs) for highly reliable 3D-TSV micro-bump Interconnection. In Proceedings of IEEE/ECTC, 331–335. Google Scholar Hiner, D., D. Kim, S. Ahn, K. Kim, H. Kim, M. Lee, D. Kang, M. Kelly, R. Huemoeller, R. Radojcic, and S. Gu. 2015. Multi-die chip on wafer thermo-compression bonding using non-conductive film. In Proceedings of IEEE/ECTC, 17–21. Google Scholar Nonaka, T., Kobayashi, Y., Asahi, N., Niizeki, S., and Fujimaru, K. 2014. High Throughput Thermal Compression NCF Bonding. Proceedings of Electronic Components & Technol. Conference, 913–918. Google Scholar Matsumura, K., M. Tomikawa, Y. Sakabe, and Y. Shiba. 2015. New non conductive film for high productivity process. In IEEE Proceedings of CPMT Symposium Japan, 19–20. Google Scholar Asahi, N., Y. Miyamoto, M. Nimura, Y. Mizutani, and Y. Arai. 2015. High productivity thermal compression bonding for 3D-IC. In Proceedings of IEEE International 3D Systems Integration Conference, TS7.3.1–TS7.3.5. Google Scholar Syed, A. 2004. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints.
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