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Author: Admin | 2025-04-28
Across the substrate, thereby providing a high-speed, low latency pathway for data transfer between the integrated dies. It also uses fine-pitch interconnects such as micro-pillars to establish the electrical connections between the integrated dies. This enables efficient data transfer by reducing signal delays and improves electrical performance due to shorter interconnect lengths.Figure 5: EMIB Technology by IntelIn conclusion, semiconductor packaging serves as the vital bridge between the intricate world of semiconductor chips and the diverse landscape of electronic devices that power our modern lives. From the early days of metal cans to the cutting-edge developments in 3D integration, semiconductor packaging has transformed our world, enabling the devices that connect us, entertain us and drive our industries.References:TSV-Based E-D ICs: Design Methods and Tools by Lu et al.How to address SiP challenges with EDA tools and IP by Ronen Laviv.Die Embedding Challenges for EMIB Advanced Packaging Technology by Duan et al.Semiconductor Packaging: A Multidisciplinary Approach by Hiroshi Iwai and Kuan-Neng Chen.Advanced flip chip package on package technology for mobile applications by Ming-Che Hsieh.
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