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Author: Admin | 2025-04-27
Die size to reduce the cost of the total chip, and to be aware of signal integrity issues. The cost for the total chip depends mainly on the used space on silicon. In the future, it is not enough to pay more attention to die size alone. The signal integrity issues like crosstalk, electromigration, hot electron, and wire self-heat become more important issues in deep submicron (DSM) designs, and this influences the die size seriously. Die size estimation. Technology inputs: gate density per sq. mm =D; the number of horizontal layers= H; the number of vertical layers=V Design inputs: gate count (excluding memories, macro & sub chip) = G; IO area, in sq. mm=I; Memory + Macro + Sub chip area, in sq. mm =M; target utilization, in percentage=U%; Additional gate count for CTS, timing closure etc., in percentage=T%; Additional gate count for ECO, in percentage=E% Die area calculation. Die Area in sq.mm = {[(Gate count + Additional gate count for CTS & ECO) / Gate density] + IO area + Mem, Macro area} / Target utilization Die Area = {[(G + T + E) / D] + I + M} / U Limitations for setting up the die size. In core-limited design, core is densely packaged and in IO or pad-limited design IOs/pads are densely packed which limits the size of the chip. a) pad-limited: In this design, there are so many pads that each pad is directly placed adjacent to the next pad. Although there is a small
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