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Author: Admin | 2025-04-27
I’ll divide it into 3 processes Mask making, Wafer making and Cutting. I’ll have to give you an intuition for couple of things before we continue. Wafer — also called a slice or a substrate, is a thin slice of a crystalline silicon. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning.Silicon WaferMask — Unlike the masks we know in those masks we uncover the places we want to print in them very similar to stencil. But instead of painting we use the microfabrication process steps we mentioned before.Metal mask for semiconductor manufacturingMask making — We take the layout design (plan for the masks) from the Digital and Analog plane merge them and then creating mask for each layer. What are layers? There are many layers in each ASIC design but i’ll give you an example for two of them. The first one is called Via mask/Interconnect and other is a Metal mask. Via mask is creating holes in specific places in order to inject metal so i could connect between 2 metals and Metal mask is where you print the metal.ASIC masks for the lithography processWafer making — We take the masks and using different microfabrication process steps on each mask we started creating the ASIC (Each layer at a time). On each wafer we create couple of ASICs simultaneouslyWafer with hundreds of ASICsCutting — Last step is cutting/dicing the ASICs on the wafer.We are now ready for packaging and send out the ASIC.
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