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Author: Admin | 2025-04-27
Hot Chips 2024 has concluded. Thank you to the speakers, attendees, sponsors, press, and volunteers!Zipfle of full program proceedings! (~180 MB)Tutorials: Sunday, August 25, 2024 Time (PDT) Title Presenters 7:45AM-8:30AM Breakfast/Registration 8:30AM-10:35AM Tutorial 1: AI Assisted Hardware Design - Will AI Elevate or Replace Hardware Engineers? Chair: Bryan Chin, UCSD Introduction Bryan Chin, UCSD Introduction to AI for Chip Design Mark Ren, NVIDIA AI Driven Optimization Stelios Diamantidis, Synopsys LLM and Chip Design Hans Bouwmeester, PrimisAI 10:35AM-11:00AM Coffee Break (1/2 hr) 11:00AM-12:30PM Tutorial 1: AI Assisted Hardware Design - Will AI Elevate or Replace Hardware Engineers? Chair: Bryan Chin, UCSD Domain Adaptive LLM Models Hanxian Huang, UCSD LLM Agents for Chip Design Mark Ren, NVIDIA Future Directions & Panel Discussion 12:30PM-1:45PM Lunch (1 hr 15 min) 1:45PM-3:15PM Tutorial 2: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution Chair: Seshu Madhavapeddy, Frore Systems Thermal techniques for higher data center compute density Tom Garvens, Supermicro Next-generation cooling for NVIDIA’s Accelerated Computing Ali Heydari, NVIDIA 3:15PM-3:45PM Coffee Break (1/2 hr) 3:45PM-6:00PM Tutorial 2: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution Chair: Seshu Madhavapeddy, Frore Systems Thermal challenges of Edge Devices Nader Nikfar, Qualcomm Solid-state active cooling helps maintain Moore’s Law Prabhu Sathyamurthy, Frore Systems Applications for thermo-electric cooling Jesse Edwards, Phononic 6:00PM-8:00PM Reception Conference Day 1: Monday, August 26, 2024 Time (PDT) Title Presenters 7:45AM-9:15AM Breakfast/Registration 9:15AM-9:30AM Welcome General Chair Welcome Ron Diamant, General Chair Progam Co-Chairs Welcome Rob Aitken & Larry Yang, PC Co-Chairs 9:30AM-11:00AM High-Performance Processors Part 1 Chair: Ian Bratt Snapdragon X Elite Qualcomm Oryon CPU: Design & Architecture Overview Gerard Williams, Qualcomm Lunar Lake: Powering the Next Generation of AI PCs Arik Gihon, Intel IBM Next Generation Processor and AI Accelerator Chris Berry, IBM 11:00AM-11:30AM Coffee Break 11:30AM-1:00PM Specialized Processors Chair: Renu Raman Blackhole and TT-Metalium - The Standalone AI Computer and its Programming Model Jasmina Vasiljevic & Davor Capalija, Tenstorrent SK Hynix AI-Specific Computing Memory Solution: From AiM device to Heterogeneous AiMX-xPU System for Comprehensive LLM Inference Guhyun Kim, SK Hynix Built for the Edge: The next generation Intel® Xeon 6 SoC Praveen Mosur, Intel 1:00PM-2:15PM Lunch (1 hr 15 min) 2:15PM-3:15PM Keynote #1 Chair: Ralph Wittig Predictable Scaling and Infrastructure Trevor Cai, OpenAI 3:15PM-4:15PM AI Processors Part 1 Chair: Pradeep Dubey NVIDIA Blackwell Platform: Advancing Generative AI and Accelerated Computing Ajay Tirumala & Raymond Wong, NVIDIA SambaNova SN40L RDU: Breaking the Barrier of Trillion+ Parameter Scale Gen AI Computing Raghu Prabhakar, SambaNova 4:15PM-4:45PM Coffee Break (1/2 hr) 4:45PM-6:45PM AI Processors Part 2 Chair: David Weaver Intel Gaudi 3 AI Accelerator: Architected for Gen AI Training and Inference Roman Kaplan, Intel AMD InstinctTM
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